Diamond Cool
← Back to Site
The only sub-ambient, zero-water, PFAS-free cooling platform engineered for the 155 kW AI rack era.
The NVIDIA GB300 NVL72 pushes 1,400W per GPU and 155 kW per rack — 17× the density of legacy infrastructure. Air cooling is physically dead.
Sources: NVIDIA, Barrack.ai, HPE, Thinkmate — See Works Cited [1]–[4]
The data center liquid cooling market is growing at 18–31% CAGR. Hyperscalers are deploying $600B+ in AI infrastructure CapEx in 2026 alone.
Sources: GlobeNewswire, GM Insights, Futurum Group, IDC — See Works Cited [5]–[14]
Major cooling companies are being acquired at massive valuations — and none of them offer sub-ambient, zero-water, or closed-loop cryogenic architecture.
| Company | Event | Valuation | Key Metric |
|---|---|---|---|
| CoolIT Systems | Acquired by Ecolab (Mar 2026) | $4.75 Billion | ~$550M NTM revenue, 29× EBITDA |
| JetCool | Acquired by Flex (Nov 2024) | Undisclosed | $17M Series A (Bosch Ventures) |
| Accelsius | Series B (Jan 2026) | $89M Total Raised | $65M round — Johnson Controls + Legrand |
Sources: Ecolab, BusinessWire, Innventure, JetCool — See Works Cited [15]–[18]
Four proprietary subsystems working together to deliver what no other company can: sub-ambient cooling at commercial scale.
PFAS-free, non-conductive nanofluid on all 72 GPUs, 36 CPUs, and 18 NVSwitch ASICs. Zero water. Zero shorting risk.
Secondary loop sub-cools silica fluid via dedicated heat exchanger. Achieves -15°C to -40°C at chip junction. Impossible with water.
Captures exhaust N₂ gas and feeds it back to the liquefier intake. Reduces ongoing energy consumption by up to 60%.
Industrial desiccant dryers strip humidity to -40°F dew point. Eliminates condensation risk. Enables standard insulation.
This transforms cryogenic cooling from a prohibitively expensive open-loop process into a commercially viable, hyperscale-ready platform.
| Cost Category | Industry Standard | Diamond Cool | Annual Savings |
|---|---|---|---|
| Cooling Electricity | $80K–$120K (PUE 1.35–1.80) | $15K–$25K (PUE 1.03–1.05) | $65K–$95K |
| Water Consumption | 1.8L/kWh (evaporative) | 0 L/kWh (closed N₂ loop) | 100% eliminated |
| HVAC Maintenance | $8K–$15K | $0 (no facility HVAC) | $8K–$15K |
| Hardware Lifespan | Standard lifecycle | 25–40% extended | Significant |
| Company | Technology | Sub-Ambient | PFAS-Free | Zero Water | Closed-Loop Cryo |
|---|---|---|---|---|---|
| CoolIT ($4.75B) | Water cold plates | ✗ | ✗ | ✗ | ✗ |
| Vertiv | CDUs, rear-door HX | ✗ | Mixed | ✗ | ✗ |
| Accelsius ($89M) | 2-phase immersion | ✗ | ✗ PFAS | ✗ | ✗ |
| JetCool (Flex) | Microjet impingement | ✗ | ✗ | ✗ | ✗ |
| Diamond Cool | Cryo-silica direct-siphon | ✓ -40°C | ✓ | ✓ | ✓ |
Full-stack IP protection covering every layer of the cooling architecture — from silicon interface to facility enclosure.
| # | Title | Strategic Value |
|---|---|---|
| 01 | Multi-Layer Impingement Cold Plate | Core hardware — direct GPU silicon interfacing |
| 02 | Closed-Loop Cryogenic Injection | Direct-siphon architecture — primary IP moat |
| 03 | Cascaded Sub-Ambient Management | Multi-stage cooling cascade for extreme density |
| 04 | Gravitational Exhaust Routing | Condensation-free sub-ambient operation |
| 05 | Thermal Propagation Barrier | Fire suppression and thermal runaway prevention |
| 06 | Modular Zoning Architecture | 3-zone segregated enclosure design |
| 07 | Refrigerant-Grade Sub-Ambient CDU | Rack-level refrigeration to -15°C |
Strategic portfolio value: $10M–$18M (internal valuation analysis)
UL-2755 certified modular sidecar CDU. Plugs into existing racks — zero facility redesign. 8-week deployment. Per-rack BOM: $77K–$99K.
Cryogenic cooling design, sub-ambient retrofit architecture, PUE optimization. $250–$500/hr specialist rates. Begins Day 1 — converts to hardware sales.
License patented cold plate designs and nitrogen recovery logic to thermal OEMs (Vertiv, Supermicro, Dell). Pure royalty revenue stream.
Diamond Cool is currently in the Prototype & Testing phase. The next 6–12 months are designed to validate performance, achieve certification, and position for first hardware revenue.
| Phase | Timeline | Milestone | Status |
|---|---|---|---|
| 1. Patent Filing | Completed | 7 utility patents filed covering full cooling architecture | ✓ Done |
| 2. Prototype & Testing | Now → Month 4 | Single-rack cold plate fabrication, silica fluid loop validation, LN₂ heat exchanger bench testing, direct-siphon manifold proof-of-concept | ◆ In Progress |
| 3. Pilot Deployment | Month 4 → 8 | Full single-rack pilot at partner lab. Measure PUE, validate sub-ambient temps (-15°C to -40°C), stress test 155 kW thermal load | Upcoming |
| 4. UL-2755 Certification | Month 6 → 10 | Submit modular sidecar CDU for UL safety certification. REACH & RoHS environmental compliance. | Upcoming |
| 5. Manufacturing Ramp | Month 8 → 12 | Partner with BDE Manufacturing (Portland) for CNC cold plates. Medford Fabrication for enclosures. Build first 5 production units. | Upcoming |
| 6. First Hardware Revenue | Month 10 → 14 | Deploy certified sidecar CDU to enterprise & colo customers. First hardware sales + consulting retainers. | Target |
| Hardware R&D & Prototype | $550K–$750K |
| Cryogenic Equipment | $200K–$440K |
| Engineering Team (18 mo) | $365K–$495K |
| UL Certification | $50K–$100K |
| Facility & Legal | $115K–$170K |
| Operating Reserve | $400K–$545K |
| Year | Revenue | Gross Margin | EBITDA Margin | Enterprise Value |
|---|---|---|---|---|
| 2026 | $0.3M–$0.8M | 10%–20% | Negative | $12M–$18M |
| 2027 | $1M–$3M | 20%–28% | Negative | $18M–$30M |
| 2028 | $4M–$10M | 26%–32% | -60% to -20% | $30M–$60M |
| 2029 | $12M–$25M | 30%–36% | ~Breakeven | $50M–$90M |
| 2030 | $25M–$50M | 34%–40% | 5%–12% | $100M–$250M |
| 2031 | $50M–$90M | 38%–45% | 12%–20% | $250M–$600M |
Margin benchmarks: CoolIT ~30% EBITDA [16], Vertiv 23.2% adj. operating [19], Modine 29.7% gross [24]
Year 3–5 timeline. Vertiv, Schneider Electric, Ecolab, Supermicro actively acquiring cooling technology.
Year 4–6 timeline. KKR sold CoolIT at $4.75B. Data center infra is the #1 PE target class.
Year 2–4. Pure IP transaction to Dell, HPE, Lenovo. 90%+ margin royalty streams on patented designs.
info@diamond.cool | diamond.cool